Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
Springer International Publishing 2014Edition: 1ISBN: 978-3-319-02378-6Online resources: Click here to access online| Item type | Current location | Collection | Call number | Status | Date due | Barcode | Item holds |
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E-Books
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Central Library, KARE, Krishnankoil Campus | Electronics and Communication Engineering | - | Available | EBK282 |
Total holds: 0
Fulltext
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