TY  - BOOK
AU  - Madhusudana
TI  - Thermal Contact Conductance
SN  - 978-3-319-01276-6
PY  - 2014///
PB  - Springer International Publishing
N1  - Fulltext
UR  - http://link.springer.com/10.1007/978-3-319-01276-6
ER  -